Senate Republicans are still finalizing their version of the budget reconciliation bill this week, but the broad strokes are already clear. While GOP senators and their House counterparts have ...

Just in few years, three-dimensional (3D) packaging technologies have attracted much more attention. With the development of through-silicon via (TSV) technology, silicon-based device integrations ...

The Compound and Friends: When Will the AI Bubble Pop?

Natural fractures are critical factors that should be considered in shale reservoir evaluation, storage condition analysis, horizontal well design, and fracturing stimulation, which also play a ...

Advanced packages for high-end applications require higher bandwidth and larger number of I/O signal processing. To achieve the highly demanded performance, heterogeneous integration has been proposed ...

I've included three tests to confirm the fix and help prevent regressions. The tests sending packets to all players or nearby players will fail without the change to GameTestServer; the test sending a ...

SD publishes high quality papers in modeling, analyzing, quantifying and predicting stochastic phenomena in science and engineering from a dynamical system's point of view.