Using Tessent Multi-die software, IC design teams can rapidly generate IEEE 1838 compliant hardware featuring 2.5D and 3D IC architectures. “IC design organizations are seeing dramatic spikes in IC ...

The new product introduction (NPI) process for heterogeneous 2.5D devices opens up a lot of possibilities but also creates many complications that need to be considered early in the process. The focus ...

Realtime Robotics today launched Resolver, a new cloud-based solution that dramatically accelerates the design and deployment of robotic workcells.

Planner 5D is currently creating machine learning algorithms that will train on over 40 million real user projects. All these projects offer an opportunity for AI to figure out the thinking process ...

VILNIUS, Lithuania, Jan. 26, 2023 (GLOBE NEWSWIRE) -- Planner 5D, a global e-design platform, reports record growth in the usage of AI-enabled features. In 2022, 156,000 projects were created with ...

swatchbook and VNTANA partner to help brands, like Merrell, ramp up their 3D design process to increase speed to market and rapidly deploy 3D at scale September 07, 2022 09:30 AM Eastern Daylight Time ...

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer.

Reply and AWS Announce Multi-Year Strategic Collaboration to Advance Generative AI Innovations, Helping Customers Design, Develop, and Deploy Scalable and Secure AI Applications Provided by ...