News

AI Data Center Design And Deployment Are Moving At An Incredible Pace: 3 Ways To Approach A Changing Landscape
For companies looking to navigate the AI data center shift, success starts with smarter design, faster simulation and ...
Design-Reuse4y
Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs
The Synopsys IP provides efficient heterogeneous integration with the shortest 2.5D interposer ... die design platform, Socionext can deliver world-class high-performance, high-capacity and ...
Hexus7y
Eurocom provides a complete line of 3D Workstations for on the go deployment of professional 3D capability
greatly expediting the design process" Mark Bialic, Eurocom President. The EUROCOM Panther 5D and Scorpius 3D support Quad Buffering 3D technology, via supported NVIDIA Quadro and GeForce cards to ...
Design-Reuse2y
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution
“IC design organizations are seeing dramatic spikes in IC test complexity due to the rapid adoption and deployment of designs featuring densely packed dies in 2.5D and 3D devices ... digital ...
SiliconANGLE5mon
Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technologies
Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process ... using 2.5D packaging. This is a chip design approach ...
Morningstar2mon
Reply and AWS Announce Multi-year Strategic Collaboration to Advance Generative AI Innovations, Helping Customers Design, Develop, and Deploy Scalable and Secure AI Applications
"Reply's deep technical expertise will help customers swiftly and responsibly deploy AI-powered applications ... policy to learn more about our process.