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Broadcom launches world’s first 3.5D F2F tech to meet soaring GenAI chip demand
Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators ...
I spent more than two weeks testing the AndaSeat Kaiser 3 Pro and found it to be exceptionally comfortable and stylish, though not revolutionary
Effectively an updated re-release of the initial AndaSeat Kaiser 3, despite the glamorous naming glow-up, the Pro line ...
Semiconductor Engineering8y
2.5D Adds Test Challenges
OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts ...