This chapter has two primary objectives: to (a) define and proliferate a standardized nomenclature for package architectures covering and clearly demarcating both 2D and 3D1 constructions and to (b) define and proliferate key metrics driving the evolution of the physical interconnects in these architectures. 1. Introduction.

A torus interconnect is a switch-less network topology for connecting processing nodes in a parallel computer system. Diagram of a 3-dimensional torus interconnect. It is not limited to 8 nodes but can consist of any number of nodes in a similar rectilinear array.

Nov 23, 2023 · The terms 2D, 2.5D, and 3D IC packaging refer to different levels of integration and stacking of components in semiconductor packaging. Let’s explore the differences between them: 2D IC Packaging:

Note that the difference between the 2D and2DO Chip Last schematic in this figure is in the interconnect density in the die‐die links. The latter has increased interconnect density enabled by finer lines and spaces along with reduced sized vias and via pads.

• Distance between any two nodes is at most log p. • Each node has log p neighbors • Distance between two nodes = # of bit positions that differ between node numbers

Jun 23, 2015 · A high-performance interconnection network, such as a hypercube, an n-dimensional torus, or a fat-tree, is used to connect all the compute nodes together. The chapter introduces some popular topologies of interconnection networks, including two-dimensional (2D) mesh and torus, 3D mesh and torus, hypercube, tree and fat tree, and k -ary n -cube.

Full circuit thermal model, including circuit layer, detailed power maps, package description, and heat sink selection. Peak performance : 220 GOPS for all 96 cores @ 1.15 GHz.

Define and proliferate a new standardized nomenclature for package architectures covering, and clearly demarcating, both 2D and 3D constructions. Currently there are a number of intermediate definitions between 2D and 3D constructions, referred to as 2.xD architectures.

Oct 1, 2004 · In this paper, we extend the comparison to torus networks with incomplete, but regular, connectivities. Taking an n D torus as the basis, we show that a simple pruning scheme can be used to reduce the node degree from 2 n to 4, while preserving many of the desirable properties of the intact network.

Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip communication demands of future multi-core embedded systems.