Beijing plans to invest 33 billion yuan ($4.6 billion) in a 12-inch wafer fab project, led by Yandong Microelectronics and BOE Technology. The facility aims to boost China’s semiconductor ...

ASML Believes Global Semiconductor Markets Will Reach $1 Trillion Valuation By 2030, Driven By Huge AI Demand: Summary ASML projects global semiconductor sales to hit $1 trillion ...

China’s legacy chip production slows in October as possibility of new US sanctions looms: Summary China's semiconductor production slowed in October, with IC output rising 11.8% ...

Samsung plans a $7.2 billion stock buyback over the next year, with an initial $2.2 billion repurchase through February. The move addresses investor concerns over its AI memory chip lag and global ...

Despite the setback, Taiwan’s Ministry of Foreign Affairs confirmed ongoing semiconductor cooperation with Lithuania. Taipei Times Read the Full Article The dedicated team at Semiconductor Packaging ...

Imec has partnered with automotive leaders to integrate chiplets into vehicle silicon, aiming to double cars' AI processing power by 2030. The Automotive Chiplet Program enhances flexibility, ...

Summary The Biden administration finalized a $6.6 billion CHIPS Act award to Taiwan Semiconductor Manufacturing Co (TSMC), securing U.S.-based semiconductor production. The deal funds TSMC's $65 ...

Applied Materials Shares Slide on Disappointing Sales Forecast: Summary Applied Materials Inc. shares dropped 10% Friday after its revenue forecast fell short of estimates, signal ...

Summary AI's energy demands are surging, with power needs expected to rise 550% by 2026 and 1,150% by 2030. Tech giants like Microsoft and Google now outpace 100 countries in electricity use, ...

Thirteen plaintiffs have filed a class action lawsuit against TSMC, alleging discriminatory hiring practices against non-East Asian individuals. TSMC denied the claims, emphasizing its commitment to ...

Summary The semiconductor industry's pivot to advanced packaging pushes engineers to tackle performance, thermal & signal challenges. High-density, high-frequency demands in AI-driven computing ...

Summary China’s largest chip-packaging firm, JCET, reshuffled its board after China Resources Group became its largest shareholder, acquiring a 22.5% stake. Key directors, including Chairman Gao ...