As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

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Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

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"So it's not about reducing capacity. It's actually increasing capacity into CoWoS-L." Hopper refers to Nvidia's GPU ...

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

TSMC (TSM.US)’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media ...

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.