Micron's memory technology is taking another step forward with the launch of its new 1γ (1-gamma) DRAM, pushing DDR5 speeds ...

By contrast, a modern Samsung 16 Gb DDR5 die measures 6.46 × 7.57 mm and has a die size of 48.90 mm^2. When Micron, Samsung, and SK hynix began to mass produce 16 Gb DDR5 memory chips in 2021 ...

The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and ...

ChangXin Memory Technologies (CXMT) has accelerated its next-generation DRAM development, transitioning from 17nm to 16nm ...

South Korea is lagging behind or matching China in "basic competency" in five areas of semiconductor technology, including ...

SK hynix has reportedly achieved a yield of 70% for its next-gen HBM4 12-Hi memory, ready for NVIDIA's next-gen Rubin R100 AI ...

NVIDIA 'secretly negotiating' with Samsung, SK hynix, and Micron to use new 'SOCAMM' modules: new RAM overcomes data ...

SK hynix breaks ground on its first fab in Yongin semiconductor cluster: Summary SK hynix has begun building its first fabrication plant at the Yongin semiconductor cluster, aimin ...

SK hynix forecasts that the demand of HBM and high ... necessary for the production of competitive DDR5 and LPDDR5. For NAND, as last year, the company plans to meet the market with profitability ...

DRAM maker ChangXin Memory Technologies (CXMT) revealed its 16 Gb DDR5 chips to the market. The devices made domestically have a chip size measuring 66.99 mm2, resulting in a 0.239 Gb/mm2 bit density.

South Korea's Samsung and SK Hynix, along with US-based Micron, currently lead the DDR5 memory market with production primarily using 12nm and 14nm nodes. With this latest offering, CXMT has ...