This acquisition will bolster Tessolve's presence in the semiconductor space, particularly in custom chip and ASIC (Application-Specific Integrated Circuit) design.

The 3D chip testing process has four main steps: For 3D integrated circuits (ICs), it is important to consider both traditional 2D IC defect and failure models as well as unique fault models specific ...

Several Chinese IC design houses are gearing up for volume production for smart driving applications in 2025 and 2026.

Apple's next-gen M5 family of processors expected in late 2025: ready for the new 11-inch and 13-inch iPad Pro, and new M5 ...

Integrated Circuits (ICs) and System-on-Chip (SoC) designs are the cornerstones of modern electronics, driving the ...

An MoU was signed between IIT Bhubaneswar and MOSart Labs, a private organisation providing a platform for professional skill training ...

IIT Bhubaneswar, in collaboration with MOSart Labs, introduces a professional diploma program in semiconductor technology and chip design aimed at making students industry-ready in VLSI ...

Taiwan Semiconductor Manufacturing Company (TSMC) halted shipments to China's Sophgo after discovering its chip on a Huawei ...

IIT Bhubaneswar has partnered with MOSart Labs to launch a professional diploma program in semiconductor technology and chip design ...