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SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

Whats next after HBM Chipmakers bet on glass substrates Glass substrates emerge as a key contender in the race for next-gen ...

Gartner predicts 66.9% growth in HBM market, boosts DRAM and NAND investments Semiconductor market set for increased ...

China's memory industry is making remarkable progress, substantially closing the technology gap with South Korea in DRAM and ...

Micron (MU) stock rallied after the memory and storage solutions company announced new innovations and products. A focus on ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and ...

Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its ...

Sandisk wants to pack an extremely large amount of fast flash memory onto GPU accelerators. Large language models would thus ...