Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth ...

Micron (MU) stock rallied after the memory and storage solutions company announced new innovations and products. A focus on ...

China's memory industry is making remarkable progress, substantially closing the technology gap with South Korea in DRAM and ...

The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

Sandisk wants to pack an extremely large amount of fast flash memory onto GPU accelerators. Large language models would thus ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its ...

The "big three" in the DRAM industry are preparing to end production of DDR3 and DDR4 memory solutions this year. Samsung Electronics, SK Hynix, and Micron ...

Gartner predicts 66.9% growth in HBM market, boosts DRAM and NAND investments Semiconductor market set for increased ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash ...