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Tech Xplore on MSN5h
3D chip stacking method created to overcome traditional semiconductor limitations
A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...
Communications of the ACM8h
Energy-Optimized Supercomputer Networks Using Wind Energy
As a result, energy-intensive infrastructures that try to maximize the use of renewable energy sources (RES), such as ...
Nanowerk9h
New 2D semiconductors offer fast charge transport and solar cell potential
Simulations reveal previously unknown 2D phthalocyanine monolayers combining structural stability, high mobility, and direct ...
eTeknix1d
Intel 18A Node Boosts Performance by 25% with Same Power Consumption as Intel 3 Node
Intel is betting on its next manufacturing node, Intel 18A, which will be used to manufacture upcoming processors such as ...
C&EN14d
High Efficiency Solar Membranes Structurally Designed with 3D Core–2D Shell SiO
College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing 100029, China ...
IEEE22d
On Performance Evaluation of Registration Algorithms for 3D Point Clouds
Abstract: 3D point Geometric alignment ... first to uncover the similarities and differences between four known RAs which are ICP, NDT, Softassign and RANSAC and then to establish an inter RAs ...
IEEE23d
2D and 3D face recognition using convolutional neural network
We find that CNN-2 has a better accuracy performance on both 2D and 3D face recognition. Our experimental results show that an accuracy of 85.15% was accomplished using CNN-2 on depth images with ...
C&EN1mon
In Situ Construction of Amide-Functionalized 2D Conjugated Metal–Organic Frameworks with Multiple Active Sites for High-Performance Potassium-Ion Batteries
Key Laboratory of Polyoxometalate and Reticular Material Chemistry of Ministry of Education and Faculty of Chemistry, Northeast Normal University, Changchun 130024, China ...