The size of pores (i.e., clearance between the two solder bumps) in the flip-chip medium is less than 100 micrometers. In this paper, a new analytical model for permeability of the porous medium or ...

Abstract: The P&I diagram (P&ID) shows the product flow structure and the functionality of a process plant. These data are a central base of the downstream control engineering and maintenance ...

Liver disease modelling: This liver model reconstructs the liver periportal region architecture ... it could be a way of moving from 2D models utilized in pharmaceutical screenings to more ...

It's a win-win, and it's why everything on iStock is only available royalty-free — including all Architecture images and footage. What kinds of royalty-free files are available on iStock? How can you ...