A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Moore's Law is Dead further revealed that there is a new type of 3D core that uses a “radical ... Zen 7 is expected to use TSMC's 1.4nm node for core chiplets and 4nm for V-Cache chiplets.

THE DEFENSE IS EXPECTED TO PRESENT ITS OWN EXPERT, WHO WILL SAY THAT O’KEEFE LAST USE A prosecution expert ... said he used a computer chip from Read's SUV to sync the vehicle's clock with ...

After his rookie deal expired at the end of the 2022 NFL season, Baltimore Ravens quarterback Lamar Jackson and the team agreed to a five-year extension worth $260 million with $185 million ...

Intel's new workstation graphics cards with Battlemage architecture ... However, Intel fails to mention that the Arc Pro B50 and B60 only use eight PCIe lanes, meaning that a fully equipped ...

Twelve more suspects were charged in a RICO conspiracy for their alleged involvement in the theft of over $230 million in cryptocurrency and laundering the funds using crypto exchanges and mixing ...

While each new iPhone comes with a USB-C charging cable, many cars still use USB-A ports to enable wired CarPlay. That’s created an annoying gap for drivers: no first-party cable to connect a ...

Professor Neil Lawrence, Visiting Professor at the School of Computer Science, on taking down the 'digital oligarchy' and why we shouldn't fear AI on BBC Radio 4's 'The Life Scientific'. What's this?

This study introduces recent technological advancements that enable the transformation of 2D-ICs into 3D-ICs using shuttle chips from multi-project wafers, ranging from small to large-scale ...

integral imaging system via a graphics processing unit (GPU) which allows parallel processing with multiple processors. We show that it can significantly accelerate 3D scene reconstruction in II using ...