Evolving component technologies are driving the transformation of the automotive industry with a shift toward SDVs, EVs and ...

Renesas introduces its new series of R-CAR V4M automotive SoCs and expands its existing R-Car V4 series for entry-level ADAS ...

Navigating the power management challenges of software-defined vehicles requires scalable and flexible PMIC platforms.

Same Sky expands its line of slide switches with over 60 new models, featuring a range of new functions and circuit types.

SDV platforms combine high-performance computing and high-speed interfaces with support for real-time updates.

Kyocera AVX’s 9179-000 series of IDC splice connectors can replace traditional crimp- and solder-style splice connectors.

Samsung Electronics Co., Ltd. has claimed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical ...

STMicroelectronics introduces FIPS 140-3 certified trusted platform modules (TPMs) for computer, server and embedded systems.

Taking advantage of data-center technologies will accelerate the pace of innovation and solve the automotive industry’s ...

Bourns, Inc. has expanded its series of high-voltage gas discharge tubes (GDTs) with the launch of Model SA2-A GDTs. This new ...

Broadcom’s Sian2 DSP PHY delivers 200G/lane for AI data centers, enabling 800G and 1.6T optical transceivers.

Congatec’s COM Express conga-TCR8 computer-on-modules feature AMD Ryzen Embedded 8000 Series processors for AI applications ...