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Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.
Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.
First, the company’s Innovator3D IC suite enables chip designers to efficiently author, simulate, and manage heterogeneously ...
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AZoM on MSNBreakthrough in 3D Chip Integration Promises Faster, More Efficient High-Performance ComputingInnovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...
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Tech Xplore on MSN3D chip stacking method created to overcome traditional semiconductor limitationsA novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...
Book Abstract: Featuring current contributions by experts in signal processing and biomedical engineering, this book introduces the concepts, recent advances, and implementations of nonlinear dynamic ...
Ultrasound computer tomography using synthetic aperture focusing technique is sensitive to phase aberration errors. We propose a signal preprocessing method for coherent imaging, which can take the ...
Siemens Digital Industries Software have introduced two new solutions to its Electronic Design Automation (EDA) portfolio ...
EEGLAB-compatible analysis software for manual / visual sleep stage scoring, signal processing and event marking of polysomnographic ... Guidance, Navigation, and Control Software and Models. control ...
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