Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite ... thermal stress ...

Abstract: We have developed a new, fast and simple 3D imaging approach referred to as Simultaneous ... A 10 MHz, 64×64 element crossed electrode relaxor array was fabricated on a electrostrictive 1-3 ...

Jake & Jordan break down the drama from the wild mid-week Mets vs. Red Sox series. Plus, the guys check-in on who is in the lead for the end of season awards as we near the one-third mark of the year ...