News
In this work, we developed a 3D scalable chamber-array chip that multiplied the number of partitions by stacking chamber-array layers and realized digital loop-mediated isothermal amplification to ...
adoc - Export in png and create an additional asciidoc file (with support external links). md - Export in png and create an additional markdown file (with support external links). Pull requests are ...
The backing for the array consists of a novel 3D printed acrylic frame that is filled with conducting and acoustically absorbing silver epoxy material. This interposer backing effectively connects ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results