This brings an array of challenges for package design, substrate technology and assembly process development. For highly integrated packaging at competitive cost, the flip chip pin grid array package ...

The Flip Chip Pin Grid Array (FC-PGA) package is used on Pentium III processors, while Plastic Pin Grid Array (PPGA) packaging is used on Celerons. This does not mean Celerons have plastic pins - that ...

Jason McMillan, product manager at Tarsus Technologies, says Intel`s Flip-Chip Pin Grid Array package is used on Pentium III processors. Subscribe . Sectors . Companies . About . NEWS .

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Nexperia has developed a packaging technology it calls flip-chip land grid array (FC-LGA) for the industry’s first ESD diodes with side-wettable flank. ... The 2- and 3-pin FC-LGA diodes have ...