Advancements in 4D/5D Models and Addition of Cost and Performance Management Make Model-based Construction Projects Easier to Deliver EXTON, Pa.--(BUSINESS WIRE)--Bentley Systems, Incorporated ...

Samsung has announced the availability of its HybridSubstrate Cube dubbed the H-Cube earlier today, November 11. This is the South Korean tech company’s latest 2.5D semiconductor packaging option.

H-Cube Structure and Features. 2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor.

H-Cube Structure and Features 2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features ...