A 3D stacked power module with interposer is introduced at the first time. Unlike conventional single sided structural or normal double-sided cooling modules, the power devices are stacked over and ...

Figure 3: AT&S Embedded Component Packaging (ECP™) Process Flow . TDK-EPC Corporation has developed its own process named Semiconductor Embedded in Substrate (SESUB™). Their embedded process is ...

The qualifications of a 2×3 and a 7×7 embedded WLCSP power module were shared in this paper. The 2×3 module was built on a switching voltage regulator with three passive components and one embedded ...

IBM’s 3D chip stacking process could revive a famous rule on computing power. Driving ‘processing power improvements for years to come.’ Published: Jul 07, 2022 07:38 AM EST ...

Stratasys Opens Michigan Tooling Hub to Bridge 3D Printing Gap in Manufacturing Stratasys Opens Michigan Tooling Hub to Bridge 3D Printing Gap in Manufacturing. ... The new Vitesco power module is ...

A state-of-the-art 3D camera module that the company describes as “revolutionizing” failure detection while significantly reducing testing time and false call rate for THT solder joints. Continuing ...

The drive supplier has already been using the process since 2020, initially for compact transmission control units. The power module is manufactured at the Nuremberg site, as the necessary ...

3D printing is a process used to create an object by sequentially adding build material in successive cross-sections, one stacked upon another. It is a form of additive manufacturing.

The evaluation platform contains a ADTF3175 module 3D time-of-flight sensor. In the video, Erik Barnes shows off the power-efficient, 1-Mpixel, 3D TOF sensor in the company's eval module.