CUPERTINO, CA—IntellaSys Corporation announced its Scalable Embedded Array (SEA) line designed to launch multicore processor products for next-generation embedded applications. Designated the SEAforth ...

CPU sockets come in two major types -- ball-grid array and pin-grid array. PGA sockets look like a checkerboard with lots of squares. They are designed to hold a CPU chip with an array of pins ...

Posted in Parts Tagged ball grid array, bga, breakout board, dead bug, stripboard, tmp006 Accessing BGA Pins December 17, 2009 by Mike Szczys 29 Comments ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...

These processors are now packaged in AM5 instead of Ball Grid Array (BGA) format. This update marks a development for the AM5 socket, expanding its range from eleven to fifteen processors.

These processors are now packaged in AM5 instead of Ball Grid Array (BGA) format. This update marks a development for the AM5 socket, expanding its range from eleven to fifteen processors.

Fischer Elektronik has added heatsinks to its ball grid array casings, a solution for thermal dissipation of electronic devices or integrated circuitry called ICK BGA.. Heatsinks available in ...