These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to competing modules, enabling designers of industrial ...

Rapid demand for power module packaging technology in autonomous vehicles and Electric Vehicles (EVs) is a key factor driving market revenue growthVancouver, Oct. 10, 2023 (GLOBE NEWSWIRE) -- The ...

Ralf Bornefeld, Senior VP, General Manager Business Unit Power Semiconductors and Modules at Bosch, discusses the many SiC-based power electronics innovations the company demonstrated at PCIM earlier ...

Innovation and collaboration are the driving forces behind the evolution of power module packaging. At ASE, we are dedicated to pioneering thermal solutions that not only enhance performance but also ...

Detailed price information for Marvell Technology Inc (MRVL-Q) from The Globe and Mail including charting and trades.

When Kaynes Semicon got greenlit by the India Semiconductor Mission in April 2024, most assumed the usual two-year delay ...

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

Mass production has already begun,” Harnack adds. Semikron Danfoss' SEMITRANS ® 20 was developed for high power applications and fast-switching operations, representing the next generation of power ...

[3] Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects. Renewable and Sustainable Energy Reviews (2019).

Valeo has partnered with ROHM Semiconductor to jointly develop the next generation of power electronics for electric motor inverters in electric vehicles (EVs).

Power modules simplify power designs and save valuable board space by combining a power chip with a transformer or inductor in one package. By leveraging TI’s 3D package moulding process, MagPack ...

Texas Instruments (TI) (Nasdaq: TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack ...