The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

The most well known packaging type is the PGA (Pin Grid Array). Being among the oldest of packaging technologies, prevalent since the Intel 80386 processor, PGA consists of a flat square with a series ...

Plastic Ball Grid Array (PBGA) is a type of surface-mount packaging for integrated circuits, where the connections are embedded in a plastic substrate and arranged in a grid of balls on the underside ...

Abstract: A three-dimensional finite element model of a plastic pin grid array (PPGA) with an internal heat slug has been developed by using the ANSYS finite element simulation code. The model has ...

The reliability of plastic ball grid array (PBGA) package is studied for different materials. The reliability of the PBGA packages using conventional Bismaleimide-Triazine type PWB and our original ...

CAMBRIDGE, UK — Following up on the availability of Intel's Core-i7 Mobile quad-core processors, Suyin has launched a reversed pin grid array socket (rPGA-989) suitable for automatic assembly. The ...

Frenchtown, N.J. – Aries Electronics has broadened its line of pin-grid-array zero-insertion-force (ZIF) Test Sockets with a 9 x 9-grid version. The units enable just one socket to handle a full range ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...

The Flip Chip Pin Grid Array (FC-PGA) package is used on Pentium III processors, while Plastic Pin Grid Array (PPGA) packaging is used on Celerons. This does not mean Celerons have plastic pins - that ...