The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

Frenchtown, N.J. – Aries Electronics has broadened its line of pin-grid-array zero-insertion-force (ZIF) Test Sockets with a 9 x 9-grid version. The units enable just one socket to handle a full range ...

Three-dimensional (3-D) nonlinear finite element models of epoxy encapsulated enhanced plastic ball grid array (EPBGA) packages with and without an aluminum lid have been developed using ANSYS finite ...

Abstract: A three-dimensional finite element model of a plastic pin grid array (PPGA) with an internal heat slug has been developed by using the ANSYS finite element simulation code. The model has ...

Plastic Ball Grid Array (PBGA) is a type of surface-mount packaging for integrated circuits, where the connections are embedded in a plastic substrate and arranged in a grid of balls on the underside ...

The most well known packaging type is the PGA (Pin Grid Array). Being among the oldest of packaging technologies, prevalent since the Intel 80386 processor, PGA consists of a flat square with a series ...

CAMBRIDGE, UK — Following up on the availability of Intel's Core-i7 Mobile quad-core processors, Suyin has launched a reversed pin grid array socket (rPGA-989) suitable for automatic assembly. The ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym b… ...