Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth ...

The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and ...

Micron (MU) stock rallied after the memory and storage solutions company announced new innovations and products. A focus on ...

China's memory industry is making remarkable progress, substantially closing the technology gap with South Korea in DRAM and ...

A new technical paper titled “Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults” was published by researchers at Yonsei University. Abstract “Through-silicon via ...

Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

Sandisk wants to pack an extremely large amount of fast flash memory onto GPU accelerators. Large language models would thus ...

Gartner predicts 66.9% growth in HBM market, boosts DRAM and NAND investments Semiconductor market set for increased ...

Micron stock has seen high levels of volatility over the last year. While the company's share price is up roughly 34% across the stretch, it's also still down roughly 31% from its high even with today ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash ...