Additionally, newer symmetry checking tools are interactive solutions that are embedded in the design flow. Challenges in symmetry checking for advanced nodes As IC designs move to smaller process ...

3D-ICs are widely viewed as the way to continue scaling beyond the limits of planar SoCs, and a way to add more heterogeneous devices developed at different process ... 3D-IC, you need a lot of ...

12-nm physical implementation flow is ... support by IC Compiler II Custom Compiler is ready to use with TSMC's 12-nm process, with immediate availability of the Process Design Kits (PDKs ...

17 Oct 2019-- Cadence Design Systems ... Cadence ® 3D-IC advanced packaging integration flow has achieved certification for the Samsung Foundry MDI ™ (Multi-Die-Integration) packaging flow based on ...