Copper precipitates as a salable copper sulphide product in the SART Process and the cyanide that is associated with the copper complex is regenerated as free cyanide. After SART, a portion of the ...

The authors describe and present simulation data on the device structure, process flow, and operation of the Trench CCD (charge coupled device), which is being developed to increase the resolution of ...

Abstract: A process has been developed that combines double-polysilicon, surface-type, n-channel charge-coupled devices (CCD's) with silicon-gate CMOS circuits on the same substrate. The process is ...

The TDI sensors are manufactured on 200mm wafers by using imec’s CCD process module inside its 130nm CMOS process flow. This cost-effective manufacturing flow is compatible with other wafer-level post ...

While CCD imagers are typically manufactured on 150mm wafers using dedicated processes, Imec has developed a CCD process module inside its 130nm CMOS process flow on 200mm wafers. This results in a ...

The TDI sensors are manufactured on 200mm wafers by using imec’s CCD process module inside its 130nm CMOS process flow. This cost-effective manufacturing flow is compatible with other wafer-level post ...

AMD is planning to develop its next-generation CCD, implementing the Zen 6 microarchitecture, using TSMC’s 3nm N3E process node. This development follows discussions on technical forums about ...