Inevitably this leads to even more reliance on Ball Grid Array ... (Quad flatpacks for example). This is because the entire ‘2D’ underside area of the package is available for connections, not just ...

Diagram of a ball grid array (BGA). Engineers can use digital image correlation (DIC) to assess its thermal expansion or warpage due to thermal, mechanical and thermo-mechanical loads. DIC is an ...

Lead-free solder has numerous undesirable characteristics, such as a higher melting point and reduced wetting than its leaded predecessor. These characteristics tend to produce more voids in solder ...