A Ball Grid Array is descended from the pin grid array (PGA): a historic ... packages offer more I/O connections than other flat package styles (Quad flatpacks for example). This is because the entire ...

However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

AN-1112, for example, covers the die-size ball-grid-array (DSBGA) wafer-scale package. The complete list can be found here, including information on older through-hole and power packages.

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in ...

One of the best examples of the value of DIC is its ability to measure the CTE and warpage of ball grid array (BGA) devices. A BGA is a complex semiconductor package consisting of multiple elements, ...

These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. The quick overview provided here offers engineers a good starting point for improving BGA ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...