Credit to improvements in chip fabrication technology for this. But inevitably this leads to even more reliance on Ball Grid Array (BGA) and other specialised Surface Mounted packaging solutions. One ...

Diagram of a ball grid array (BGA). Engineers can use digital image correlation (DIC) to assess its thermal expansion or warpage due to thermal, mechanical and thermo-mechanical loads. DIC is an ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...