3D chip stacking has long held promise as a meaningful method of advancing silicon performance, ... the block diagram below shows two separate chips mounted to the same package, ...

Finally, chip stacking obviously works in synergy with Intel's 3D FinFETs -- though curiously there is no sign of TSV on Intel's roadmap, while TSMC is all over it.

Intel has been working on 3D chip stacking for four or five years, Gomes said. "I do not expect anybody to easily follow us." First published Dec. 12, 6 a.m. PT.

Three-dimensional (3D) integration using through-silicon vias (TSVs) and low-volume lead-free solder interconnects allows the formation of high signal bandwidth, fine pitch, and short-distance ...

Samsung Electronics has successfully applied 3D stacking technology on a test chip that was made using the 7nm extreme ultraviolet (EUV) chip making process, the company said on Thursday.

A 3D chip stacking method using precise, high-speed bonding and a novel adhesive enables direct integration of processing units above DRAM, overcoming 2D packaging limitations. This architecture ...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its ...