in a stacked design allowing for improved capacity and throughput while remaining power efficient. The cells were designed as a modified 3D NAND process, with NEO hoping that existing 3D NAND ...

Magnetic Packaging Translates into More Power in Less Space By leveraging TI's exclusive 3D package-molding process ... 6-A output step-down power module with integrated inductor (Fig.

Additive manufacturing (AM), otherwise known as 3D printing ... process that creates three-dimensional, physical objects via a computer design file. Challenges when dealing with high-power ...

Fig. 2: Power modules, a four-dimensional design challenge. Today, a high count of prototypes determines the power module design process. Power module compliance checking could drastically reduce this ...

ST has brought out an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection ... ST’s stacked-wafer manufacturing process with backside illumination enables unparalleled resolution with ...

A breakthrough development in photonic-electronic hardware could significantly boost processing power for AI and machine ... of processing three-dimensional (3D) data, substantially boosting ...

today announced the new OCH2B30 camera module for three-dimensional (3D) intraoral dental scanners. The OCH2B30 features a compact CameraCubeChip® package in an ultra-small form factor (2.6 mm x ...

In this webinar, Florian Kamp will be sharing his experience with RadCalc’s 3D EPID module. He will be covering his observations in setting up RadCalc’s dose engine, along with the hardware ...