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3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per modulein a stacked design allowing for improved capacity and throughput while remaining power efficient. The cells were designed as a modified 3D NAND process, with NEO hoping that existing 3D NAND ...
Magnetic Packaging Translates into More Power in Less Space By leveraging TI's exclusive 3D package-molding process ... 6-A output step-down power module with integrated inductor (Fig.
ST has brought out an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection ... ST’s stacked-wafer manufacturing process with backside illumination enables unparalleled resolution with ...
The advantages of 3D digital twins when it ... and the usual improvements in power, performance, and area (PPA) that come with every new process node are waning. Thus, semiconductor firms are ...
Fig. 2: Power modules, a four-dimensional design challenge. Today, a high count of prototypes determines the power module design process. Power module compliance checking could drastically reduce this ...
The company has just announced the development of a 3D camera unit compact enough to be used in mobile devices and capable of capturing movies in 720p high definition. The new module ...
3D printing is a process used to create an object by sequentially ... principal solutions leader with 3D Systems Inc., said as a guest on The POWER Podcast. 3D Systems claims to have launched ...
A breakthrough development in photonic-electronic hardware could significantly boost processing power for AI and machine ... of processing three-dimensional (3D) data, substantially boosting ...
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