Based on NEO’s existing 3D X-DRAM technology, the new cells are advertised as being able to hold 512 Gb (64 GB) on a single module ... throughput while remaining power efficient.

A new 3D chip stacking method developed in Japan promises to revolutionize AI and high-performance computing with faster data transfer, reduced power consumption, and compact integration.

A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure ...

Analog Devices' Erik Barnes shows off a power-efficient, 1-Mpixel, 3D ToF sensor module. 1. The evaluation platform contains a ADTF3175 module 3D time-of-flight sensor. In the video, Erik Barnes ...

Power modules simplify power designs and save valuable board space by combining a power chip with a transformer or inductor in one package. By leveraging TI's exclusive 3D package molding process ...

Hyliion will exhibit at Booth #6205, where it will showcase the KARNO TM Power Module, a fuel-agnostic system designed to redefine the future of power generation. As part of the event, Hyliion ...

Ideal Power's SymCool IQ power module order highlights growing demand in EVs, renewable energy, and data centers. SymCool power module rating increased by 25% to 200A, enhancing performance for ...

ST has brought out an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution ... The cameras with ST’s sensor inside combine the ...