CDimension launches, debuting ultra-thin 2D semiconductor materials, marking a key milestone towards vertically integrated chips.

10. 3D flash memory will completely replace 2D floating-gate memory. While 3D flash memory has clearly become today’s dominant flash-memory architecture, certain applications still use legacy 2D ...

Micron and SK Hynix are turning up the pressure on each other with 3D NAND chips made up of more than 230 layers. Check out more coverage of the 2022 Flash Memory Summit. Memory chip giants are ...

Sandisk's 3D Matrix Memory offers DRAM-like performance with four times the capacity at half the price, developed in collaboration with IMEC.

Key strategies include the production of sustainable, negative carbon emission concrete using recycled materials with carbon sequestration capabilities, electrification of the concrete casting process ...

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D X-AI™ chip technology, targeted to replace the ...

NEO Semiconductor has announced its latest 3D X-AI chip technology, which it wants to replace the HBMs currently used in AI GPU accelerators. The 3D DRAM boasts built-in AI processing capabilities ...

The 3D NAND flash memory market is highly competitive and technology-driven, with leading players focused on next-gen architecture, product diversification, and capacity expansion.