10. 3D flash memory will completely replace 2D floating-gate memory. While 3D flash memory has clearly become today’s dominant flash-memory architecture, certain applications still use legacy 2D ...

You may like 3D X-DRAM technology will bring bigger, faster memory by 2026, but there's no way these 512GB modules will sell to consumers; Sandisk could use new architecture called Stargate to ...

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today that its ground-breaking technology, 3D X-AI™, captured the top prize at ...

Kioxia's UFS 4.1 memory devices are developed to meet the demands of next-generation mobile applications, including ...

According to NEO Semiconductor, this 3D memory offers a 100-fold performance improvement thanks to its 8,000 neutron circuits that handle AI processing in memory.

Stacked memory up to 512GB sounds revolutionary, ... At the core of NEO’s approach is a vertically stacked architecture that mimics the structure of 3D NAND. In NEO’s own words, ...

A single 3D X-AI die has 300 layers of 3D DRAM cells with 128Gb capacity, and one layer of neural circuit with 8000 neurons. NEO's estimates that its new chip can support up to 10TB/sec of AI ...

Using cutting-edge genetic tools, 3D electron microscopy, and artificial intelligence, Scripps Research scientists and colleagues have uncovered key structural hallmarks of long-term memory ...

The Global 3D NAND Flash Memory Market is on a rapid growth trajectory, with its market value expected to rise from USD 29.7 billion in 2023 to a projected USD 118.8 billion by 2032, expanding at a ...