Hence, with Cascade, we have started experiments to also probe our 20µm-pitch micro-bump arrays, and those look promising.” One of the challenges of 3D IC stacking is probing ... for automatic test ...

Imec and Cascade Microtech, a FormFactor company, have announced the successful development of a fully automatic system for pre-bond testing of advanced 3D ... probe our 20µm-pitch micro-bump ...