NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new ...

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...

A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

Intel has also been stacking with its 2.5D technology since 2019, and it is implementing its 3D chip stacking technology Foveros for chip packages as well. Advantages of glass substrates ...

3D photonic chip module. Credit: Keren Bergman Artificial intelligence (AI) systems promise transformative advancements, yet their growth has been limited by energy inefficiencies and bottlenecks ...

The module is built into a custom, handheld capture system. The ADTF3175 chip has 1k × 1k resolution with a 75-degree field of view (Fig. 2) . The imager lens integrates a 940-nm bandpass filter.